Malaysia launches RM90m semiconductor fund to boost advanced packaging
KUALA LUMPUR: The Malaysian government has launched a RM90 million Science Endowment matching fund to establish the country as a global leader in advanced semiconductor packaging, a sector currently dominated by nations like Taiwan. Deputy Prime Minister Datuk Seri Fadillah Yusof announced the initiative, emphasising its role in modernising Outsourced Semiconductor Assembly and Test (OSAT)… Continue reading Malaysia launches RM90m semiconductor fund to boost advanced packaging